Surface finishing on electrical components can be a challenging process that requires knowledge and experience.
At C&M, we work with our partners in developing enhanced surface finishing technology that provides excellent quality products and reduce the cost of plating.
We offer complete solutions for various plating processes such as reel-to-reel type, rack type, and barrel type plating. Our ENIG chemistry offers excellent uniformity, high deposition rate and superior bath stability. We supply gold, silver, copper, palladium, and tin chemistries that suit different sectors of the electronics industry such as leadframe, flexible circuit board, printed circuit board, connectors, and other vital electrical components. In addition, our ultrafine polishing media meets the exacting standards of our silicon wafer manufacturers for surface roughness and rate requirements.